Pemtron develops surface-mount technology inspection equipment based on 3D precision measurement and vision source technology
A leading inspection equipment developer and supplier, Pemtron Technology recently announced that the company went public on the Korea Stock Exchange (KRX) last week, under the ticker symbol: 168360:KS. With the aim to become the unrivalled global No. 1 inspection equipment company, it envisions expanding policies to enhance shareholder value and maximize corporate profits by supplying unique hi-tech products.
Pemtron CEO, YW Yoo said: “On the semiconductor side, which has been growing recently, we plan to launch equipment for wafer pattern inspection in the mid-end process, wire bonding in the back-end process, MEMS automatic inspection, package automatic inspection and automatic memory module inspection. Some of this equipment is already contracted with leading global companies in Korea.”
Primary product offerings of Pemtron include Surface-mount technology (SMT) inspection equipment of solder paste, semiconductor wafers, wire bonding, package, memory module, FC -BGA PCB circuit and secondary battery. The company claims that its equipment is based on inspection technology using 3D measurement and AI deep learning based on machine vision and image processing S/W technology using industrial high-speed camera images.
The Korea Stock Exchange is a part of the Korea Exchange (KRX). Initially, Korea’s stock market was a standalone entity. In 2005, the Korea Stock Exchange merged with the Korea Futures Exchange and the electronic market, KOSDAQ, to form the Korea Exchange. Notably, the exchange is the only securities exchange operator in South Korea, making markets in equities, bonds, stock index futures, stock index options, and equity options.
Seoul-headquartered Pemtron develops equipment based on 3D precision measurement and vision source technology. Such equipment is used in various fields such as lead tab, SMT, automotive field and semiconductors. 2002-born Pemtron also supplies Soldering Inspection equipment (3D SPI), 3D Mounting Inspection equipment (3D AOI, MOI), Wafer Bump 3D inspection equipment, Wire Bonding 3D inspection equipment, and lead tab process/inspection equipment.