Semiconductor packaging options

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In March 2012, Texas Instruments Incorporated (TI) unveiled new and expanded semiconductor package options that are available with bare dies.

Features and USP: The company’s bare die programme allows customers to order small quantities as low as 10 pieces for initial prototyping purposes, and larger quantities of full waffle trays for production purposes. Bare die options also provide the capability to integrate multiple functions into smaller areas. With electronic products and systems rapidly getting smaller and more integrated, bare dies enable customers to design end equipment with smaller form factors by implementing multi-chip modules (MCM) or systems-in-package (SiPs).

For further details: www.ti.com/baredie-pr.

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