Samsung Launches New Business Division for AI Chips

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Operating under the Device Solutions (DS) division, the unit’s focus is on developing transformative technologies like its 3 nm GAA technology.

Samsung Electronics Co., the global leader in memory chip manufacturing, has launched a new business unit dedicated to advancing next-generation chip processing technology. This move is part of Samsung’s strategy to stay ahead of competitors like Taiwan Semiconductor Manufacturing Co. (TSMC) in the artificial intelligence (AI) chip market.

The division, led by newly promoted President Hyun Sang-jin, will focus on developing breakthrough technologies to position Samsung at the forefront of the semiconductor industry for the coming decades. Hyun has been crucial in Samsung’s technological advancements, including the mass production of 3-nanometer chips.

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Operating under the Device Solutions (DS) division, which manages Samsung’s semiconductor operations, the unit’s focus is on developing transformative technologies that will keep Samsung ahead in the industry for the next few decades. One such technological advancement is Samsung’s gate-all-around (GAA) architecture, a cutting-edge microfabrication process unveiled last year, which significantly enhances chip performance, power efficiency, and design optimization.

Samsung Device Solutions

Samsung’s 3 nm GAA technology, offering substantial improvements in performance, energy consumption, and chip size reduction, stands as a major competitor to technologies like the fin field-effect transistor (FinFET) process used by TSMC and others. The GAA technology, recognized for its improved electrostatic properties, promises a 30% increase in performance, a 50% reduction in energy use, and a 45% decrease in chip area compared to previous nodes.

Despite being the top memory chipmaker, Samsung trails behind TSMC in the foundry or contract chipmaking sector. To bridge this gap, Samsung also plans to relocate its chip packaging technology development unit closer to Seoul, enhancing its competitiveness in advanced packaging.

The new business unit dedicated to next-generation chip processing technology aligns with its ambition to dominate the AI chip sector. As projected by electronics business analyst firm, Gartner, this market segment is expected to expand significantly, from the current estimate of $53.4 billion to a staggering $119.4 billion by 2027.

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