The research was conducted using Intel’s second-generation silicon spin test chip
The Intel Labs and Components Research organizations recently announced that they achieved the industry’s highest reported yield and uniformity to date of silicon spin qubit devices. It was developed at Intel’s transistor research and development facility, Gordon Moore Park at Ronler Acres in Hillsboro, Oregon.
It is noteworthy that the research was conducted using Intel’s second-generation silicon spin test chip. Through testing the devices using the Intel cryoprober, a quantum dot testing device that operates at cryogenic temperatures (1.7 Kelvin or -271.45 degrees Celsius), the team isolated 12 quantum dots and four sensors. The official statement said: “This result represents the industry’s largest silicon electron spin device with a single electron in each location across an entire 300 millimeter silicon wafer.”
Director of Quantum Hardware at Intel, James Clarke commented: “Intel continues to make progress toward manufacturing silicon spin qubits using its own transistor manufacturing technology. The high yield and uniformity achieved show that fabricating quantum chips on Intel’s established transistor process nodes is the sound strategy and is a strong indicator for success as the technologies matures for commercialization.” Clarke added, “In the future, we will continue to improve the quality of these devices and develop larger scale systems, with these steps serving as building blocks to help us advance quickly.”
It is noteworthy that Intel is to showcase the full results of this research at the 2022 Silicon Quantum Electronics Workshop in Orford, Québec, Canada.
Intel is a leading tech house working to advance the design and manufacturing of semiconductors. It says that by embedding intelligence in the cloud, network, edge and every kind of computing device, Intel unleash the potential of data to transform business and society for the better.
