Resonac to open R&D Center for Semiconductor Packaging in U.S.

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Notably, U.S.’s Chip for America is aiming to improve advanced chip packaging technology in the U.S.

Resonac, a Japanese manufacturer specialising in chip materials, has announced plans to establish a research and development centre for advanced semiconductor packaging and materials in Silicon Valley by 2025.

Recognizing the growing importance of the packaging stage in semiconductor production, Resonac (previously known as Showa Denko) aims to contribute to the advancement of chip technology. This move aligns with the U.S.’s recent initiative, which involves a $3 billion program to enhance packaging capabilities. Additionally, Japanese firms in the chip sector, including the foundry venture Rapidus, are strengthening their ties with the U.S., with Rapidus planning to open a sales office in the U.S. within the current financial year.

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In the electronics segment, Resonac deals in semiconductors, ceramic materials, and hard disk drive platters, vital components for the electronic and computer industries. Resonac has a global presence with over 180 subsidiaries and affiliates.

Resonac, a diversified company with extensive operations, operates in five key business areas including petrochemicals, aluminium, electronics, industrial gases and inorganic materials focusing on ceramics and graphite electrodes. It engages in significant overseas activities, including a joint venture with Montell (Netherlands) and Nippon Petrochemicals for polypropylene production and marketing.

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