KLA Launches Electronics, Packaging and Components Group

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  • The company said that this move will extend KLA’s leadership in systems and services across the semiconductor and microelectronics value chain
  • The EPC group joins KLA’s existing business units, Semiconductor Process Control, and Global Support and Services

KLA Corporation has announced the formation of a new business group focused on growth in its Electronics, Packaging and Components (EPC) businesses. It will be under the leadership of KLA executive vice president Oreste Donzella. The company said that this move will extend KLA’s leadership in systems and services across the semiconductor and microelectronics value chain. The EPC group will bring together the ICOS, Orbotech and SPTS technologies organisations to aim at growth opportunities in new and expanding end markets.

Rick Wallace, president, and CEO of KLA said, “This new group integrates KLA’s acquisition of the Orbotech and SPTS business to bring complementary technologies, products, and services into one organization to drive innovation and results in fast-growing markets. By applying the KLA operating model, we will enable common processes that allow the new group to deliver superior value to our customers across the electronics value chain. This strategy is expected to accelerate profitability and growth in segments outside our core semiconductor process control markets, as outlined during our September 2019 investor day.”

Innovation across specialty semiconductor processes, advanced packaging

Technologies like 5G, artificial intelligence (AI), and the Internet of Things (IoT) are driving growth across key industries like mobile, data centres, automotive and virtual connectivity. This has lead to innovation across specialty semiconductor processes, advanced packaging, and printed circuit board (PCB) manufacturing.

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Advanced packaging technologies and high-density interconnects are employed in high-performance computing (HPC) to enable AI. Wafer processing capabilities for new substrate materials like silicon carbide (SiC) and gallium nitride (GaN) are speeding the transition to electric vehicles. Novel packaging designs like integrated antenna in RF devices are crucial to enable the advancement of 5G connectivity. Micro-Electro-Mechanical Systems (MEMS) and IoT sensors for healthcare, smart homes and smart factories will also help to improve lives in the future.

Changing needs of the customers

KLA said that the new business organisation will help KLA to be even more focused on meeting the changing needs of the customers and the marketplace during the growth phase. The EPC group joins KLA’s existing business units, Semiconductor Process Control (which creates and deploys highly-differentiated inspection and metrology products as per the company) and the Global Support and Services. This managing the company’s recurring revenue subscription-based services group and KLA Pro legacy systems.

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