Tuesday, November 11, 2014:
In August 2014, SemiLEDs Corporation announced sampling and volume availability of a complete line of 80×80mil rugged metal LED chips, including white, blue and UV variations. The EV 80mil family allows packagers and integrators a wider variety of high efficiency/high output choices to address the growing number of applications in both the commercial lighting and industrial spaces. The new family of single 80×80mil devices will replace four 40×40mil LED chips, which simplifies packaging and optical designs while minimising colour fringing and shadow effects common to multi-chip implementations. The EV family, which combines vertical LED architectures with rugged copper alloy substrates, has proven to be especially well suited for handling the increased thermal and electrical demands of large chip implementations.
For further details: Ph: 9871155223, [email protected]/[email protected], www.tslc.com.tw
Electronics Bazaar, South Asia’s No.1 Electronics B2B magazine
