Samsung Could Follow SK Hynix And Adopt MUF Chip Manufacturing Method

- Advertisement -

Samsung is already in talks with material manufacturers, including Japan’s Nagase to source MUF materials.

Samsung Electronics plans to adopt a chip-making technology used by its rival SK Hynix to boost the production of high bandwidth memory (HBM) chips, for powering artificial intelligence applications. Samsung, who traditionally used non-conductive film (NCF) technology for chip-making, could adopt the mass reflow molded underfill (MR-MUF) method.

The company has recently issued purchase orders for chip-making equipment designed to handle the MUF technique, indicating a shift in its approach to ramp up. HBM production yields.The company plans to use both NCF and MUF techniques for its latest HBM chips, but mass production of high-end chips using MUF is unlikely to be ready until next year

- Advertisement -

This decision comes as Samsung seeks to catch up in the AI chip race, where it has lagged behind SK Hynix and Micron Technology in supplying HBM chips to Nvidia, the leader in AI chips. Samsung has relied solely on the NCF technology that causes some production issues which could have led to it lagging behind. In contrast, SK Hynix switched to the MR-MUF method, which addresses the weaknesses of NCF.

Samsung claims that its NCF technology is sufficient and has issued a statement saying “rumours that Samsung will apply MR-MUF to its HBM production are not true”. But sources say that Samsung is already in talks with material manufacturers, including Japan’s Nagase to source MUF materials.

The company’s HBM3 chip production yields are significantly lower than SK Hynix’s. Samsung’s HBM3 yields are estimated at about 10-20%, while SK Hynix has secured about 60-70% yield rates for its HBM3 production.

Samsung Chip

The HBM chip market is expected to more than double this year to nearly $9 billion, driven by AI-related demand. SK Hynix’s success in switching to the MR-MUF technique has allowed it to become the first vendor to supply HBM3 chips to Nvidia, securing a dominant market share in HBM3 and more advanced HBM products.

The non-conductive film chip manufacturing technology is a method used by chipmakers to stack multiple layers of chips in a compact high bandwidth memory (HBM) chipset. This technique involves using a thermally compressed thin film to minimize the space between stacked chips, allowing for higher memory density and improved performance.

One of the challenges with this approach is the use of adhesive materials, which can lead to manufacturing complications as more layers are added. To address these challenges, chipmakers like Samsung are exploring alternatives to traditional adhesive materials. For example, Samsung’s latest HBM3E chip uses 12 chip layers but likely employs advanced manufacturing techniques to reduce the reliance on adhesive materials.

- Advertisement -

Most Popular Articles

LEAVE A REPLY

Please enter your comment!
Please enter your name here
Captcha verification failed!
CAPTCHA user score failed. Please contact us!

Exclusive

“Capitalise On ‘China Plus Two,’ Where Products With Higher Value Addition Become The Focus”

0
EPIC Foundation aims to transform India into an electronics hardware product nation by collaborating with governments, universities, design houses, and startups. In a conversation...

Exclusive: Electric Two And Three Wheelers In Focus For AMP 2030

0
It seems that the Indian government is going to focus on electric two— and three-wheelers. Taking these beyond Tier 1 and 2 Indian cities...

Report Suggests India’s EV Sales Will Surge, Rising 66% In 2024

0
In 2023, sales of electric vehicles (EVs) in India almost doubled due to increased consumer interest, government actions, better infrastructure, and climate change worries....

Buzz

Honda plans major EV factory construction in Canada,

0
Honda's dedication to this facility reflects its wider ecological objectives, which include a target to only offer zero-emission vehicles by 2040 and to attain...

Scoop: Finayo Plans Rs 100 Cr Financing Fund For EV Dealerships

0
While EV finance is improving in Bharath (Tier 2, 3, 4 cities, and rural India), it is still one of the biggest challenges! Can...

HubSpot Expands Presence In India With New Bengaluru Office

0
With a focus on local engagement and accessibility, HubSpot aims to tap into India's diverse talent pool while catering effectively to the Indian market. HubSpot...

Important Sectors

Honda plans major EV factory construction in Canada,

0
Honda's dedication to this facility reflects its wider ecological objectives, which include a target to only offer zero-emission vehicles by 2040 and to attain...

Scoop: Finayo Plans Rs 100 Cr Financing Fund For EV Dealerships

0
While EV finance is improving in Bharath (Tier 2, 3, 4 cities, and rural India), it is still one of the biggest challenges! Can...

Macquarie Group To Invest $1.5 Billion In Indian Fleet Electrification With Vertelo Launch

0
Vertelo has entered into a long-term lease agreement with Tata Motors, committing to purchase up to 2000 electric cars within the next three years....

Log9 Launches Amphion And Nexmile To Strengthen EV Landscape

0
The company is focused on tackling key issues in the commercial electric vehicle (EV) industry, such as financing, data analytics, charging infrastructure, and energy...
Sona Comstar

Sona Comstar Launches Mexico Plant For North American EV Demand

0
The new facility, established to address the increasing demand for premium driveline solutions for BEVs in North America, will focus on manufacturing differential assemblies...

Manufacturing

Honda plans major EV factory construction in Canada,

0
Honda's dedication to this facility reflects its wider ecological objectives, which include a target to only offer zero-emission vehicles by 2040 and to attain...
Sona Comstar

Sona Comstar Launches Mexico Plant For North American EV Demand

0
The new facility, established to address the increasing demand for premium driveline solutions for BEVs in North America, will focus on manufacturing differential assemblies...

Sterling Tools Inks MoU With Yongin For EV Components Facility

0
Sterling Tools announced that this strategic partnership is anticipated to bring in Rs 250 crore in business over the next five years. This collaboration...

Tata Elxsi-Renesas MCU Boosts EV Cost Efficiency And Market Speed

0
The Motor Control Unit's modular, scalable design facilitates integration across various EV applications, reducing time to market by 40%, lowering design and development costs...

Ramkrishna Forgings To Supply Powertrain Parts To Top US Electric Carmaker

0
Indian producer of rolled, forged, and machined products enter the US electric vehicle market for the first time. Ramkrishna Forgings, an Indian supplier of rolled,...