- Amkor to cater diverse sectors such as automotive, high-performance computing, and mobile applications
- The company has applied for funding from the CHIPS program, which specialises in advancing chip packaging technology
Amkor will create a new advanced chip packaging facility in the U.S. The estimated amount to spend on this project is 2 billion dollars, and the location is Arizona. TSMC will produce the package chips at its Fab 21 nearby.
Apple has recently shared its plan to become the largest customer of the facility.
Amkor’s upcoming facility is slated to be situated within an expansive 55-acre manufacturing campus near Peoria, Arizona.
While specific details about the plant’s production capacity and supported technologies remain undisclosed, Amkor has confirmed its intention to cater to diverse sectors such as automotive, high-performance computing, and mobile applications. This implies a readiness to facilitate a broad spectrum of 2.5D and 3D packaging technologies.
In pursuit of securing necessary resources for this advanced packaging project in the United States, Amkor has applied for funding from the CHIPS program, which specializes in advancing chip packaging technology.
The facility is well-poised to receive government funding, given its potential to bolster the American semiconductor supply chain significantly. Moreover, its presence will provide TSMC’s Fab 21 customers in Arizona with convenient access to advanced packaging methods, eliminating the need to transport their wafers across state lines.