SmartSoC solutions will provide chip design services and system-level solutions, making it easier for customers to adopt TSMC’s technology.
Chip design services provider SmartSoC Solutions has partnered with Taiwan Semiconductor Manufacturing Services (TSMC) to become a part of its Open Innovation Platform’s Design Center Alliance (DCA).
The twenty-seven companies within the alliance collaborate with TSMC to provide chip implementation services and system-level design solutions. They offer their expertise, resources, and support to facilitate the implementation of TSMC’s technology and enhance innovation within the semiconductor industry.
This collaboration provides SmartSoC access to TSMC’s process technology information, design methodologies, and support services. The company provides its services to TSMC’s customers for 3nm to 180 nm chips throughout the frontend processes (logic and circuit design), backend services (place and route, full custom layout and post layout analysis) and other design services, including Design-for-Test and turnkey solutions.
Commenting on the significance of the collaboration, CEO Bharath Desareddy said, “By leveraging collective expertise and resources, we aim to drive innovation and shape the future of India’s semiconductor landscape.”
TSMC Open Innovation Platform (OIP) is designed to streamline the semiconductor design process, by reducing design barriers and improving the success rate of silicon chips. Key components of the OIP initiative include TSMC’s intellectual property (IP), design implementation tools, and design for manufacturability (DFM) capabilities. It also provides access to TSMC’s advanced process technology and backend services.
Established in 2016, SmartSoC Solutions offers semiconductor, embedded, and system design services at its design centres in Bangalore, Hyderabad, and Hubli, with a global footprint spanning the USA, South Korea, Sweden, Malaysia, Israel, Canada, and Finland.
