The semiconductor advanced packaging market growth is driven by the growing trend of miniaturization
The global market for semiconductor advanced packaging is estimated at US$36.7 billion in the year 2022, is projected to reach a revised size of US$50.6 Billion by 2026, growing at a CAGR of 7.7 per cent. Flip Chip Packaging, one of the segments analyzed in the report, is projected to grow at a 7.3% CAGR to reach US$40.2 Billion.
The Semiconductor Advanced Packaging market in the U.S. is estimated at US$3.3 Billion in the year 2022. The country currently accounts for a 9.48% share in the global market. China, the world’s second largest economy, is forecast to reach an estimated market size of US$14.3 Billion in the year 2026 trailing a CAGR of 9.8% through the analysis period.
The semiconductor advanced packaging market growth is driven by the growing trend of miniaturization. Constant transitions and miniaturization of nodes were regular features that the industry faced, and now ULSI fabrication resulting in increased wafer sizes are further driving market growth. With many companies focusing more on R&D, there is rise in the number of manufacturers who offer innovative products. Factors such as growing numbers of consumers using electronic appliances, consumer preference for lighter, thinner, and smaller products driving the need for electronic products with advanced architecture, and the growing demand for connected devices such as tablets and smartphones are also driving growth of semiconductor advanced packaging market. Growing interest in device miniaturization in various sectors is driving market gains. Further, the growing use of 2.5D packaging in chips and 3D IC in smartphones and other mobile devices is anticipated to spur advanced packaging demand.
Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 5.3% and 6% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 5.4% CAGR while Rest of European market (as defined in the study) will reach US$1.5 Billion by the end of the analysis period. North America is an important market for advanced packaging technologies, where growth is supported by the existence of several semiconductor companies, and increasing initiatives by the government to encourage the semiconductor and electronics manufacturing sector.
Increasing demand for wireless sensor/mobile, fingerprint sensors, and CIS is expected to fuel the growth of WLCSP and Copper pillar in the Asia Pacific region. Further, the rising IoT penetration in several areas, supportive government policies in various countries, and the growing focus on smart infrastructure and smart city are fueling market growth in the region.