Inspection systems form an integral part of the manufacturing process today. Thus it is important for the industry to stay up-to-date about the new features and technologies in this domain
By Sneha Ambastha
PCB assembly work using SMT lines involves a number of operations that require the use of inspection systems at various stages. These inspection systems can be classified into three different categories, such as X-ray inspection, automatic optical inspection (AOI) and solder paste inspection (SPI). Although, AOI systems are used for simple work using optical vision technology, X-ray inspection is used during complicated processes involving sophisticated multiple layers with connections beneath the chips like in ball grid array (BGA) packages. The SPI systems detect the solder joint defects during the printing process by gauging the volume and alignment of the solder paste.
While SPI and AOI systems have 2D and 3D automatic equipment, X-ray inspection systems are available in manual (MXI), semi-automatic and automatic inspection system (AXI) variants. Listed below are few of the recently launched inspection systems.
Model: S730, Brand: Omron, Manufacturer: Omron Asia Pacific Pte Ltd
This upgraded version of the S730 is a 3D optical inspection system from Omron with multiple cameras. Available at a price starting from US$ 200,000, the S370 can perform the tasks of both SPI and AOI systems. It has true 3D PCB inspection technology with the Omron-patented true colour (RGB) highlight system, which is not available with any products offered by the firm’s competitors, company sources claim. This system can be used for all critical PCB inspection requirements in the automobile, defence, medical, railway and aerospace verticals.
Key features:
- Ensures efficient improvement cycle for manufacturing of high quality products
- Supports quality management during the PCB production process
- Enables stable inspection of solder joints through Omron’s unique technology
- Supports the phase shift inspection principle to detect the postures of diffusing surfaces like components and leads
- Comes with an auto-generated inspection program for post reflow situations
- Capable of reducing the secondary reflection and shadow interferences
USP: Has five high-resolution cameras (one top and four angled) along with two projection systems
Contact details: www.ia.omron.com
Indian distributor: Leaptech Corporation, Suresh Nair, Ph: 9820-709940, [email protected], www.leaptech.in
Technical specifications:
- Inspection speed: 600ms/FOV
- System hardware: Windows based industrial computer
- System configuration: Can be configured as per customer requirements
- Inspection area: For PCB sizes up to 510mm x 460mm
- Footprint of optical probe: 1100mm x 1470mm
- Height: 1500mm
- Conveyor length: 1100mm
- Weight: 800kg
- Application area: PCB assembly
Model: MV 6E Omni series, Brand: MIRTEC, Manufacturer: MIRTEC, Korea
MV 6E Omni is an automatic optical inspection (AOI) system upgraded in January 2016. It can inspect the height of various components with a combination of both high and low frequency Moire patterns. Its linkage to the main camera helps it apply three-dimensional inspection to detect various defects with accuracy. This AOI system is used in various electronics manufacturing industries like home appliances, mobiles, defence products, automotive and LEDs.
Key features:
- Is a fully three-dimensional inline vision inspector
- Comes with a 15 megapixel high-resolution camera, Moiré 8 projections, and 10 megapixel side cameras for better inspection results
- Enabled with 8-phase coaxial colour lighting system to allow inspection of up to 03015 (mm) chips
- Helps obtain 3D images without blind spots using four 3D projections
- Its Moiré projection unit measures a component in four directions (East/West/North/South) to obtain 3D images
- Comes with a high-speed defect detection feature
USP: Enabled with full 3D inspection features to detect defects flawlessly
Contact details: www.mirtec.com
Indian distributor: Samsung C&T, Pradeep Tandon, Ph: +91-9810001345, [email protected], www.samsungcnt.com
Technical specifications:
Inspection speed:
- Option 1 (15μm) 0.80 sec/FOV / 4,260mm²/sec
- Option 2 (10μm) 0.80 sec/FOV / 1,890mm²/sec
System hardware: Robot positioning system: X/Y axis servo motor system
Resolution: 1μm
Repeatability: ±10μm
System configuration:
- Lens configuration: Precision telecentric compound lens
- Projection system: SXGA (LCOS 1,280 x 1,024)
- Lighting system: 8-phase coaxial colour lighting system
- Side viewer camera system (optional): 10 megapixel digital colour side cameras (4ea)
- Barcode system (optional): Keyence 1D, Leuze (1D-Scan), Data Logic (1D), Cognex (1D/2D), or Micro Scan (1D/2D)
Inspection area:
- Option 1 (15μm): 50mm² ~ 460mm²
- Option 2 (10μm): 50mm² ~ 480mm²
Footprint: 1080mm x 1,470mm
Height: 1,560mm
Conveyor length:
- Option 1 (15μm) 460mm
- Option 2 (10μm) 480mm
Power: Single phase(s) 200~240V 50~60Hz, 1.1 KW
Weight: Approximately 950kg
Application area: Various electronics manufacturing industries
Model: V810 S2i XXL, Brand: ViTrox, Manufacturer: ViTrox Innovation Centre
The V810 S2i XXL is the latest 3D in-line advanced X-ray inspection system (AXI) from ViTrox. It has been designed to examine different board sizes in the PCB assembly process, even at the micron level, for maximum throughput. Thus, it increases production efficiency and cost savings for manufacturers. The V810 S2i XXL can be used for multiple functions like global surface modelling (GSM), patented phase shift profilometry (PSP 2), variable magnification (VM) and the digital tomosynthesis methodology.
Key features:
- Can inspect various advanced packages, such as heavily shaded high-speed packages, multi-stacked POP, micro packages, GBx-T and pin-in-paste
- Capable of inspecting press fit depth/bent (with the PSP feature)
- Uses the floodfill inspection method for void defects
- Enabled with pin-through-hole (PTH) wetting coverage
- Comes with the head-in-pillow (HIP) inspection capability
USP: World’s fastest and best test coverage AXI system for the PCB SMT assembly line
Contact details: www.vitrox.com
Technical specifications
- System resolution: 19um /13um
- 100 per cent press-fit testability: Yes (With PSP2 feature)
- Maximum panel area that can be inspected: 654mm X 965mm
- Footprint: 2240mm(W) x 2460mm(D) x 1980mm(H)
- Weight: ~5500kg
- Application area: PCB SMT assembly lines
Model: Flexia BGA inspection system, Brand: Optilia, Manufacturer: Optilia Instruments AB
The Flexia BGA inspection system is an ESD protected, manually operated machine from Optilia. It is capable of producing high-resolution digital images in high-definition and admirable colour clarity. The inspection system is flexible, time- and cost-effective, and designed to meet the requirements of electronics manufacturers. It is EPA approved according to IEC and EN standards.
Key features:
Comes with 1080p full high-definition (HD) resolution to enable easy optical inspection without any lag
Has a foot switch that allows hands-free controls to capture zoomed images
Has a live image overlay feature that enables the display of cross-line, graticules and zoom factor
One can remotely control the settings (magnification, focus, brightness, etc) of the inspection system for different requirements and lighting conditions
Enabled with larger depth of field for quick and easy work
USP: Free sight, full HD 30x zoom inspection system with laser pointer, single-rod stand and joystick control unit
Contact details: www.optilia.eu
Indian distributor: Mectronics Marketing Services, Ph: +91-11-43041581/42208256, [email protected], www.mectronics.in
Technical specifications
- Inspection speed: This is a manually operated machine and hence no speed parameter is specified with it
- System hardware: HD camera and related hardware
- System configuration: 558.8mm HD monitor
- Inspection area: Field of view at 1x zoom: 223mm x 125mm and 35x zoom: 7.5mm x 4.2mm
- Footprint of optical probe: 250mm x 250mm
- Height: 500mm
- Conveyor length: 515mm
- Weight: 0.20kg
- Application area: Inspection – repair, rework, assembly work, etc
Model: 3D SPI 8030-2, Brand: Kohyoung, Manufacturer: Koh Young Technology Inc.
The recently launched 3D SPI 8030-2 is a three-dimensional solder paste inspection system with an improved C-platform model. This platform helps provide a common body structure for both SPI and AOI systems, and supports common parts sharing between both the models. The global list price of this system varies from US$ 110,000 to US$ 270,000. With the ever-increasing complexity and miniaturisation of SMT components, the industry is always on the look-out for accurate and reliable inspection systems. The company claims that today, Koh Young inspection machines are being used in almost every industry segment such as automotive, telecom, consumer electronics, LED lighting, set-top boxes, electronic energy meters, etc, to boost productivity.
Key features:
- Ensures 3D inspection with fool-proof defect capture capabilities and repeatability
- Enables shadow-free inspection through its 3D shadow-free Moire technology and patented dual projection system
- Delivers accurate and repeatable results
- Uses charts such as histograms, Xbar and R, Xbar and S charts as well as process capability tools for defect rate analysis
- SPC analysis tool helps in defect rate analysis, to carry out root cause analysis of defects and offset the parameters in the printer
- Has a large installation base
USP: Delivers the most accurate and repeatable results
Contact details: www.kohyoung.com
Indian distributor: NMTronics India Pvt Ltd, Ph: +91 120 4603500, [email protected], www.nmtronics.com
Technical specifications:
- Inspection speed: 22 – 55 cm²/sec
- System hardware: Controlled by industrial PC
- System configuration: Windows 7 Ultimate, 64 bit
- Inspection area: 510mm x 510mm
- Footprint: 1000mm x 1265mm
- Height: 1627mm
- Conveyor length: 985mm
- Power: 200-240V AC single phase, 50/60Hz
- Weight: 800kg
- Application area: SMT PCB assembly
