This July, Texas Instruments Incorporated (TI) has introduced the most highly integrated piezo haptic driver for mobile consumers and industrial designs.
Features and USP: The DRV8662 features an integrated 105-V boost converter, a power diode, and 50-V to 200-V peak-to-peak (Vpp) fully differential amplifiers, resulting in a solution size that is 50 per cent smaller than that of its leading competitors. The DRV8662 also lowers total solution costs by 40 per cent compared to competing solutions, thanks to an efficient, transformerless design. Piezo modules enable fast startup times (1.5 milliseconds), thin form factors and high bandwidth, resulting in the production of haptic effects not possible with intertial based actuators.
These devices drive piezo actuator capacitances from 50 to 680 nanofarad (nF) at 300 Hz, enabling a wide variety of high resolution haptic effects, including feedback localised to specific areas of the device, as well as vibrations and pulses that change in frequency based on how the user is interacting with the device.
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