Indian ESDM industry: Challenges and opportunities ahead

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At the recently held Electronics System Design and Manufacturing (ESDM) workshop in Bangalore, deliberation among various speakers from the industry brought out some trends that are prevalent in the industry. It was observed that the rate of change of technology has not slowed down yet, 28nm-node made semiconductor chips are much more powerful than 40nm semiconductor chips. 20nm, and 14nm are very well getting ready in labs. Femtocell, cloud computing, mobiles devices and mobile-apps are happening now and the best in technology is yet to come, both by devices and application.

The cheap graphene material is expected to replace silicon, more integration of MEMS, and other such non-transistor devices on CMOS chips are some of the few examples of disruptive technologies visible at the horizon.

Sanjay Nayak, CEO and MD of Tejas networks said that in today’s world you do not need to own a factory to build a product. But India needs global scale manufacturing companies to support its new policy of electronics manufacturing. In the telecom equipment domain Sanjay, India should be net exporter not a net importer.

India’s component industry badly needs support of government to survive. There is just a skeleton of component manufacturing base available in India, speaking on behalf of PCB industry, Paresh Vasani, President Circuit Systems India said Indian PCB manufacturers are pushed to the corner.

The major challenge for Indian electronic component industry is (mainly non semiconductor) lack of material availability in Indian market. Much of material such as special polymers, alloys, epoxy, copper and ferrite are imported from china and many such places.

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