Tools and Equipment: New products (September 2013)

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Saturday, September 14, 2013: 

Optical inspection system

In June 2013, GOEPEL Electronic launched an enhanced version of its optical inspection system to inspect fluorescing conformal coating. The TOM system (Teachable Optical Measurement) can be used for the inspection of PCB coatings as well as PCB areas, which mustn’t be coated. The maximum PCB size is 460 x 400 mm. Because of its modular design, the system can be adjusted to specific test requirements. The range of possible standard camera configurations extends from one to multiple camera configurations (1 MP to 5 MP), as colour or black/white variants. In addition to conformal coating inspection, the TOM in-line system can be utilised, e.g., for component presence, selective solder joint inspection, display and LED checking as well as colour recognition and optical character reading.

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For further details: [email protected], www.goepel.com

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M2MLogger

In July 2013, Techno Instrumentation launched the LADDERLOGIX series of M2MLoggers. It comprises advanced data-logging devices that collect, store and transmit metered data to device cloud. Built-in Ethernet and optional GPRS connectivity enables high speed, real-time streaming of metered data to the cloud. The device can be remotely managed over the cloud to avoid frequent field visits.

I/O modules extend the capabilities of data-logging devices. Optional modules can be connected to perform additional inputs/outputs that are not directly supported by the device. These versatile devices are completely topology agnostic, so that monitoring needs under any conditions can be easily fulfilled.

For further details: Ph: + 91-11-22112232, [email protected], www.m2mlogger.com

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3D X-ray inspection system

In June 2013, Kyoritsu Electric India Pvt Ltd introduced the automated inline 3D X-ray inspection system (AXI), NXI-3300, from Nagoya Electric Works Co Ltd. NXI-3300 is capable of inspecting soldering of leaded components, chip components as well as BGAs and CSPs. Nagoya’s proprietary X-ray image-capturing and processing technology substantially reduces the time required to inspect the entire double-sided PCB (measuring 330 mm x 250 mm) to about 75 seconds (NXI-3300), which is the quickest in the industry. Four models, including NXI-3300 and NLX-5000, are available in Nagoya’s NXI series. The other two models are the NXI-2DYIMH—an inline 2D AXI, and the NXI-2DY—a standalone 2D AXI, both capable of automatically inspecting minimum 25µm diameter voids in solder bumps of BGAs and CSPs.

For further details: Ph: 0520-2471678, [email protected], www. kyoritsuelectric.com

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Electronics Bazaar, South Asia’s No.1 Electronics B2B magazine

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