SiC Fab in the Czech Republic to Increase Production Capacity by 16 Times

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This facility by onsemi is targeted to address the demand over the next two years.

Supply Chain shortage has overtaken the world in such a huge way that no country is leaving any stone unturned to meet the increasing demand for chips. onsemi inaugurated the expansion of the silicon carbide (SiC) fab in Roznov, Czech Republic on the 21st of September 2022.

The event saw many honourable guests, as the ribbon-cutting ceremony was led by the Ministry of Industry and Trade Section Chief Zbyněk Pokorný, Governor of the Zlín Region, Radim Holiš and City Mayor Jiří Pavlica. as well as other local governmental dignitaries, signifying the importance of this event and manufacturing of semiconductors in the Czech Republic.

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In 2019, onsemi added SiC polished wafer and epitaxy (EPI) wafer production to the existing silicon polished and epitaxy wafer and die manufacturing in Roznov. To address the demand and multiply SiC EPI manufacturing the reconstruction of the new building began last year. The company aims to address the demand over the next two years, by increasing the site’s SiC production capabilities by 16 times and creating 200 jobs by the end of 2024. 

The total investment so far is more than $150 million in the Roznov site. 

Simon Keeton, executive vice president and general manager of Power Solutions Group at onsemi, said “Together with our SiC boule production expansion in Hudson, NH, these increased SiC manufacturing capabilities enable onsemi to provide customers the critical supply assurance to meet the rapidly growing demand for SiC-based solutions,” said. “Full control over our SiC manufacturing supply chain and the market-leading efficiency of our products underscore onsemi’s progress toward SiC leadership.”


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