Wednesday, May 22, 2013: NEPCON Malaysia will return from June 10 – 12, 2013 at the Penang International Sports Arena (PISA). It is the only complete electronics manufacturing exhibition and the single largest sourcing ground in Malaysia for the PCB/SMT, components, testing & measurement, and support services sectors. Three feature segments – ‘Go Green’, ‘Medical Devices’ and ‘New Products’ will be highlighted at the exhibition, thus offering visitors more sourcing opportunities from a wider range of industry segments.
Alongside NEPCON Malaysia, the organisers will be featuring ‘Automation @ NEPCON’ — a dedicated platform from which to discover the latest trends in the ever-evolving field of advanced manufacturing and be up-to-date with the latest applications of state-of-the-art machines.
With the participation of exhibitors such as AION Co Ltd, APP Systems Services Pte Ltd, Chip Hua Equipment & Tools Pte Ltd, Crest Systems, Dou Yee Enterprises (S) Pte Ltd, Dukane IAS, FASTECH Co Ltd, FESTO, QES (Asia Pacific) Sdn Bhd, Long Shine Equipment & Supplies Pte Ltd and Transtechnology Pte Ltd confirmed for NEPCON Malaysia this year, the exhibition will be an ideal venue for visitors to connect with new suppliers and make new contacts to increase their sourcing options.
NEPCON Malaysia 2013 prides itself on having international brands such as Heller, Nikon, Olympus Corporation, Samsung Techwin, Yamaha Motor Co Ltd and IM Company represented on the show floor. This year, too, the China, Singapore and Taiwan pavilions will make NEPCON an exhibition that is truly international.
The last edition of NEPCON Malaysia saw 306 international participating companies from 18 countries, and NEPCON Malaysia 2013 is slated to return with more quality buyers and interactive activities spread over three days.
Visitors can also learn about the latest technologies at the workshops organised by the Knowledge Group in conjunction with NEPCON Malaysia 2013. The conference will deliver a comprehensive overview of the emerging technology trends and the challenges of the electronics packaging industry. Professionals from the industry will be able to gain new insights from speakers that include Bhanu Sood from the University of Maryland’s Center for Advanced Life Cycle Engineering, Dr Bong Kok Liang from Blue Ocean Data Solutions, Dr Thomas Dory from Arizona State University, as well as Phil Zarrow and Joe Belmonte from ITM Consulting.
The IPC hand soldering competition will be held at the show over the three days. Skilled operators from Malaysia will gather to perform soldering operations according to specifications. This will be an eye opener for those attending NEPCON Malaysia.
The first 100 to pre-register as trade visitors and attend the exhibition will receive a mystery prize. Participate in the show’s referral programmes to win great prizes such as an iPad mini or a return ticket to your desired destination (terms and conditions apply). For more information on NEPCON Malaysia 2013, please visit http://www.nepcon.com.my/en/Visiting/register/.
Don’t miss out on this key electronics manufacturing event that gives you opportunities to learn more about the latest technologies and network with more than 5,000 industry professionals.
| NEPCON Malaysia 2013 |
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NEPCON Malaysia is the single largest sourcing ground for the PCB/SMT, components, semiconductor, testing & measurement, and support services sectors in Malaysia. It is well recognised by the electronics industry in Malaysia as the most effective platform for international suppliers to launch their new products and services to local and regional buyers, gain new contacts and grow new businesses. NEPCON Malaysia is part of the NEPCON family of events that are held in China, Japan, Korea, Thailand and Vietnam.June 10 – 12, 2013 (Mon – Wed)10am – 6pm, dailyPenang International Sports Arena (PISA) Penang, Malaysia Website: www.nepcon.com.my Email: [email protected]
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