The i3 equipment in Endicott, New York will be relocated to TTM’s Chippewa Falls, Wisconsin campus.
TTM Technologies, a leading global printed circuit board (PCB) and radio frequency (RF) components manufacturer, has acquired certain manufacturing and intellectual property assets from i3 Electronics (i3).
The acquired assets consist of equipment, patents and critical manufacturing know how based on i3’s technology base and pedigree along with the future addition of engineering talent.
The i3 equipment in Endicott, New York will be relocated to TTM’s Chippewa Falls, Wisconsin campus. The financial terms of the transaction have not been disclosed, but the company said it will be funded from the existing cash on hand.
The acquisition strengthens TTM Technologies’ advanced technology PCB capabilities and IP portfolio for emerging applications in the aerospace and defence end market.
Expectation from the acquisition
“We are excited to add i3’s cutting edge technology to TTM’s broad base of PCB expertise in North America for deployment in both our commercial and aerospace and defence end markets,” said TTM’s CEO, Tom Edman.
“We believe this transaction will allow us to address key future growth opportunities for advanced applications in the defence and commercial markets with the ultimate goal of providing differentiated technical support and value for our customers,” he added.
Headquartered in Binghamton, NY, i3 Electronics provides high performance electronic solutions consisting of design and fabrication of printed circuit boards and advanced semiconductor packaging. It also offers full turnkey services for printed circuit board assembly and integrated circuits assembly and test, systems integration, cable and harness manufacturing, and world class reliability and failure analysis laboratories.
TTM stands for time-to-market, representing how TTM’s time-critical, one-stop manufacturing services enable customers to shorten the time required to develop new products and bring them to market.