- It will utilise TSMC’s 5-nanometer technology for semiconductor wafer fabrication and have a 20,000 semiconductor wafer per month capacity
- TSMC said that the construction is planned to start in 2021 with production targeted to begin in 2024
Taiwan Semiconductor Manufacturing Co (TSMC) said that it intends to build and operate an advanced semiconductor fab in the United States. TSMC’s total spending on this project, including capital expenditure, will be approximately $12 billion from 2021 to 2029. government and the State of Arizona
The facility will be built in Arizona and will be possible only after mutual understanding and commitment to support from the U.S. federal government and the State of Arizona. It will utilise TSMC’s 5-nanometer technology for semiconductor wafer fabrication and have a 20,000 semiconductor wafer per month capacity. It will also create over 1,600 high-tech professional jobs directly, and thousands of indirect jobs in the semiconductor ecosystem as per the company.
Production targeted to begin in 2024
TSMC said that the construction is planned to start in 2021 with production targeted to begin in 2024. It added in an official statement, “This U.S. facility not only enables us to better support our customers and partners, it also gives us more opportunities to attract global talents. This project is of critical, strategic importance to a vibrant and competitive U.S. semiconductor ecosystem that enables leading U.S. companies to fabricate their cutting-edge semiconductor products within the United States and benefit from the proximity of a world-class semiconductor foundry and ecosystem.”
The company said that this project will require significant capital and technology investments from TSMC. It added that the strong investment climate in the United States and its talented workforce make this and future investments in the U.S. attractive to the company. TSMC also said that the U.S. adoption of forward-looking investment policies to create a globally competitive environment for a leading-edge semiconductor technology operation in the U.S will be key to the success of this project.
At the moment, TSMC operates a fab in Camas, Washington, and design centres in both Austin, Texas, and San Jose, California in the U.S. This facility will be TSMC’s second manufacturing site in the United States.