Tessolve And NXP Semiconductors Team Up For Connected Cluster

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This partnership will deliver a flexible, user-friendly platform that enhances the user experience while prioritizing safety and efficiency.

Tessolve has announced a strategic collaboration with NXP Semiconductors, aiming to expedite the implementation of a cutting-edge Digital Connected Cluster (DCC) solution specifically designed for mass-market vehicles. This partnership brings together Tessolve’s engineering prowess and NXP’s semiconductor expertise to deliver a Digital Connected Cluster platform that seamlessly integrates into two-wheelers and three-wheelers. The heart of this sophisticated system is NXP’s i.MX RT1170 crossover MCU, complemented by the AW611 Wi-Fi/Bluetooth combo chip, KW45 Bluetooth LE smart access MCU, and PF5103 multi-channel PMIC, providing a feature-rich solution for Original Equipment Manufacturers (OEMs).

The Digital Connected Cluster, powered by NXP’s i.MX RT1170-based SMARC SoM boasts a 5-inch display, which can be upgraded to a 7-inch version, and is outfitted with state-of-the-art chipsets enabling BLE and Wi-Fi 6 connectivity, alongside a multi-channel power management system and CAN interface, making it a comprehensive, production-ready package.

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Dan Loop, Vice President and General Manager of Automotive Edge Product Lines at NXP, highlighted the crucial role of high-resolution digital displays in ensuring the safe operation of electric vehicles. He emphasized that the new DCC solution offers advanced graphics, smartphone connectivity, and essential vehicle information, all within a cost-effective system, thereby enhancing the driving experience and safety for EV operators.

Echoing this sentiment, Kiran Kumar Nagendra, AVP- Embedded Systems at Tessolve, elaborated on the flexibility of the new digital cluster, which is built on Tessolve’s 3-D product engineering principle. This framework ensures that the solution can be adopted ‘as is’ or customized to meet specific OEM needs, significantly accelerating the time-to-market for new vehicle models.

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Aryaman Raghuvanshi
Aryaman Raghuvanshi
Aryaman Raghuvanshi is a Journalist at EFY. His passion is to explore the future of mobility, which gets him to cover latest technologies shaping the future of automobiles and EVs. But, at times he writes on broader technologies too. LinkedIn: https://www.linkedin.com/in/aryaman-raghuvanshi-2431b7153

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