It’s revenue for the month of October 2020 was NT$2,068.7 million (US$72.4 million). The same represents an increase of nine per cent as compared to September 2020
ChipMOS Technologies INC. (ChipMOS), an industry provider of outsourced semiconductor assembly and test services, has reported consolidated financial results for the third quarter ended 30 September 2020. The company’s revenue for the third quarter of 2020 was NT$5,686.1 million (US$196.4 million). These figures represent an increase of 4.8 per cent from NT$5,428.1 million (US$187.5 million) in the second quarter of 2020 and an increase of 5.3 per cent from NT$5,399.1 million (US$186.5 million) for the same period in 2019.
The third quarter of 2020 represents a six year high quarterly revenue level. The company’s net non-operating expenses in third quarter of 2020 were US$6.2 million. The difference between the third quarter and the second quarter of 2020, as ChipMOS noted, is mainly due to an increase of the share of loss of associates accounted for using equity method, which was partially offset by a decrease of foreign exchange loss.
It’s revenue for the month of October 2020 was NT$2,068.7 million (US$72.4 million). The same represents an increase of nine per cent as compared to September 2020 and an increase of 8.9 per cent compared to October 2019.
“This represents a record monthly high revenue level, with approximately nine per cent sequential and year over year revenue growth. ChipMOS continues to benefit from increasing demand in its memory and DDIC businesses, led by continued growth in the Company’s smart mobile and consumer markets, with stability in its computing, and automotive and industrial markets,” read ChipMOS’ official statement.
ChipMOS’ revenue for the month of August 2020 was NT$1,902.5 million (US$64.8 million), an increase of 0.8 per cent as compared to July 2020 and a decrease of 0.5 per cent compared to August 2019. The company had then noted that it was benefiting from increased DDIC and bumping demand driven by new HD-grade smartphone models, along with large- and mid-size panels to meet TDDI, TV, notebook tablet growth, respectively. Wafer test capacity of high end platform for DDIC is almost fully utilized due to increased demand combined with required longer TDDI test times.