Panasonic Teams Up With IBM Japan To Enhance Semiconductor Manufacturing

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  • IBM Japan and Panasonic will jointly develop a data analysis system that will be incorporated into Panasonic’s edge devices
  • The current method will be combined with techniques and technology that IBM Japan has developed for semiconductor manufacturing
  • The companies aim to develop the new system for the back-end process first, then prospect an expansion of the scope to the front-end process in the future

Panasonic Corporation’s subsidiary, Panasonic Smart Factory Solutions Co., Ltd. has collaborated with IBM Japan, Ltd to develop and market a new high-value-added system to utilize the overall equipment effectiveness (OEE) of customers’ semiconductor manufacturing processes.

About the partnership

IBM Japan and Panasonic will jointly develop a data analysis system that will be incorporated into Panasonic’s edge devices. The aim of the companies is to significantly reduce the number of engineering processes required and to improve the operating rates of manufacturing facilities.

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The system aims to develop an automatic recipe generation system for plasma dicers, which is a new advanced packaging production method that is drawing increased attention in the semiconductor manufacturing field, and a process control system that incorporates an FDC system in plasma cleaners.

Panasonic currently develops and markets edge devices and manufacturing methods that contribute to improving semiconductor manufacturing of advanced packaging. These new devices and methods include dry etching equipment, plasma dicers to produce high-quality wafers, plasma cleaners that increase metal and resin adhesion and high-accuracy bonding devices.

The current method will be combined with techniques and technology that IBM Japan has developed for semiconductor manufacturing. This will help Panasonic create smart factory technology. These include data analysis systems including advanced process control (APC) and fault detection and classification (FDC), as well as an upper-layer manufacturing execution system (MES) — thus improving quality and automating production management in semiconductor manufacturing processes.

The two companies aim to develop the new system for the back-end process first, then prospect an expansion of the scope to the front-end process in the future.

 

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