- The MoU was signed in the presence of Royal Dutch Couple – King Willem-Alexander & Queen Maxima and senior cabinet ministers of both the countries
- The MoU shows a strong technology collaboration between the two technology giants
- This partnership will help in enhancing the product development skills of Indian engineers
NXP India has signed a Memorandum of Understanding (MoU) with HCL Technologies for next-gen advanced electronics and semiconductor product development. The MoU shows a strong technology collaboration between the two technology giants to co-develop the automotive product family for global automotive customers.
About the partnership
“Considering the transformations taking place in the industry, this MOU will be a win-win situation for both the companies, speeding up the semiconductor development and time to market,” said Sanjay Gupta, vice-president & India country manager, NXP India.
He added, “With the joint expertise, we would be able to solve the roadblocks swiftly and quickly to develop meaningful solutions in the areas of advanced automated connected cars and low power IoT applications to expand the Indian semiconductor ecosystem.”
He also stated, “In line with the Indian government’s ‘Skill India’ initiative, this partnership will help in enhancing the product development skills of Indian engineers and they will get the opportunity to work on high-tech projects within the country.”
NXP India is one of the largest design centers for NXP Semiconductors and is involved in the development of semiconductor hardware and software designs for the embedded market in various application segments like Automotive, Security & Connectivity, Digital Networking, and next-generation technological departments.
NXP India also joined the inaugural ceremony of India-Netherlands Technology Summit 2019 to strengthen the semiconductor ecosystem between the two countries.