Intel Announces New $4.6B Chip Assembly, Test Facility In Poland

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  • The Poland facility would be located near Intel’s planned site in Madgeburg, Germany and its existing facility in Ireland.
  • The new facility would create approximately 2,000 Intel jobs

Chip manufacturing giant Intel has announced a new semiconductor assembly and test facility worth $4.6 billion in Wrocław, Poland which is expected to go live by 2027. The company is still waiting for an approval from the European Commission to start construction.

The company stated that the new facility would create approximately 2,000 Intel jobs and thousands of indirect supplier and temporary construction jobs.

The new site would be located near Intel’s planned site in Madgeburg, Germany and its existing facility in Ireland. While the Germany and Ireland plants will produce the wafers, which serve as the base of a microchip, the proposed Polish plant will cut those wafers into individual chips and assemble and test them before they’re shipped off to customers.

Explaining the increased cost efficiency for Intel’s European chip supply chain with collaboration between the three facilities, CEO Pat Gelsinger said, “Poland is already home to Intel operations and is well positioned to work with Intel sites in Germany and Ireland. It is also very cost-competitive with other manufacturing locations globally and offers a great talent base that we are excited to help to grow.”

Poland’s prime minister Mateusz Morawiecki called it the largest greenfield investment in the country’s history. The company stated that the facilities will be constructed according to green building principles and will operate with high environmental standards to minimise carbon footprint and environmental impact.

The latest announcement comes after Intel announced its plans to expand its entire semiconductor value chain in Europe with investments worth $33 billion across France, Germany, Ireland, Italy, Poland and Spain.

EU legislators came up with an industrial policy plan worth $47 billion, under the Chips Act, last April. The EU has been looking at increasing the bloc’s market share in the global semiconductor value chain from the current 9% to 20% by 2030.


 

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