SACm is a high-reliability solder paste that increases the drop-shock performance in portable electronics by 800%, without compromising on thermal cycling. SACm
The platform consists of Pb-Free solder pastes using Indium Corporation’s patent-pending SACm solder paste technology for board-side interconnect, and SACm
Indium8.9HF halogen-free, Pb-free solder paste is one of the standard flux vehicles for SACm. Indium8.9HF provides excellent soldering performance under high temperature and long reflow processes. It offers unprecedented stencil print transfer efficiency to work in the broadest range of processes.
Indium Corporation products will be on display at stand 7-430.