- Lam Research mentioned that this platform delivers machine learning algorithms that allow the tool to self-adapt to minimise process variations
- The platform’s smaller footprint benefits either a new fab build or a fab undergoing a node-to-node technology conversion
Lam Research Corporation (Nasdaq: LRCX) has announced the launch of a completely transformed plasma etch technology and system solution. The company mentioned that this technology is designed to provide chip-makers with advanced functionality and extendibility required for future innovation.
“Lam is introducing the most innovative etch product that has been developed in the last 20 years. Sense.i extends our technology roadmap to meet our customers’ next-generation requirements while solving the critical cost scaling challenges they’re facing in their business. With more than four million wafers processed on Lam etch systems every month, Lam has an installed-base that provides extraordinary learning to innovate, design, and produce the best tools for semiconductor manufacturing,” said Vahid Vahedi, senior vice president and general manager of the Etch product group at Lam Research.
Etch capabilities
Lam’s Sense.i platform, as per the company, offers unparalleled system intelligence in a compact, high-density architecture to deliver process performance at the highest productivity, supporting logic and memory device roadmaps through the coming decade. “With core technology evolved from Lam’s industry-leading Kiyo and Flex process modules, the Sense.i platform enables the critical etch capabilities required to continue advancing uniformity and etch profile control for maximising yield and lowering wafer costs. As dimensions shrink and aspect ratios increase, the Sense.i platform is designed to support future technology inflections,” read Lam’s official statement.
It continued, “Powered by Lam’s Equipment Intelligence technology, the self-aware Sense.i platform enables semiconductor manufacturers to capture and analyze data, identify patterns and trends, and specify actions for improvement. Sense.i also features autonomous calibration and maintenance capabilities that reduce downtime and labor costs, and delivers machine learning algorithms that allow the tool to self-adapt to minimize process variations and maximise wafer output.”
The Sense.i platform, as per the company, can offer 50 per cent improvement in etch output density. It’s smaller footprint benefits either a new fab build or a fab undergoing a node-to-node technology conversion.
