India’s First Fab Unit Likely By 2024: Report

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An official said apart from the main factory unit, a plan for on-site housing of all employees may also be approved

The country’s first fabrication unit may come out sometime around 2024 as the government targets to approve the application of at least one big global semiconductor fabrication company before March 31, a report by The Indian Express noted.

Citing government officials, the report said that the Ministry of Electronics and Information Technology (MeitY) is likely to target 2024 for the formal opening. With regards to the approval of a global fab company, the source informed that the ministry plans to give the winning bidder 700-750 days to complete the construction of the new unit.

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“We have actively engaged with all the leading companies over the last two months. We reached out to Apple and other big companies such as Samsung to understand how they operate their mega-factories across the world. We will be bringing those learnings to India,” one of the official said.

An official said apart from the main factory unit, a plan for on-site housing of all employees may also be approved.

Senior officials from the MeitY have, over the last few weeks, also met officials from the Labour Ministry to understand and finalise the change in regulations needed to approve factories where 40,000-1,00,000 people can work and live in the same premises.

Additionally, the MeitY has had meeting with a few states like Karnataka, Odisha, Andhra Pradesh, Tamil Nadu, Maharashtra, and Madhya Pradesh for the housing on campus plan.

Initially, any one factory from one of these states will be chosen to run a pilot of the housing on campus plan, one of the ministry officials said.

Last December, the Cabinet had approved a Rs 76,000-crore plan for semiconductor and display manufacturing ecosystem in the country. As a part of the plan, the Centre has lined up incentive support for companies engaged in silicon semiconductor fabs, display fabs, compound semiconductors, silicon photonics, sensors fabs, semiconductor packaging and semiconductor design.

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