Infineon And Amkor Forge Partnership To Boost Semiconductor Manufacturing In Europe

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With operations set to commence in the first half of 2025, this alliance represents a significant stride in advancing the region’s semiconductor manufacturing resilience and technological prowess.

Infineon Technologies has announced a strategic partnership with Amkor Technology, Inc., a provider of semiconductor packaging and test services. The collaboration aims to bolster Infineon’s outsourced backend manufacturing capabilities in Europe. Both companies agree to operate a dedicated packaging and test center at Amkor’s manufacturing site in Porto, Portugal. The operations are expected to kick off in the first half of 2025.

This long-term agreement marks a significant step in strengthening the partnership between them, moving beyond the traditional Outsourced Semiconductor Assembly and Test (OSAT) business model. Amkor will enhance its facilities in Porto to run the production line and provide dedicated clean room space. Infineon, in turn, will supply an onsite team to offer engineering and development support. This cooperation is poised to fortify the European semiconductor supply chain, making it more resilient, particularly for automotive customers, and will balance Infineon’s diversified manufacturing footprint between in-house and outsourced production capabilities.

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Alexander Gorski, Executive Vice President and responsible for Infineon’s global Backend Operations, expressed enthusiasm about deepening the partnership with Amkor, emphasizing the joint effort to increase geographical resilience and supply security for customers. He highlighted the significance of strengthening Europe’s position in semiconductor manufacturing and Infineon’s long-standing presence in Porto’s semiconductor ecosystem.

Giel Rutten, Amkor’s president and chief executive officer, also expressed pride in expanding the partnership with Infineon. He noted Amkor’s continued investments in its Porto manufacturing site, expanding capacity, and broadening its advanced packaging and test technology portfolio. Rutten emphasized that this collaboration is another milestone for both companies in enhancing supply chain resiliency for advanced products supporting automotive and industrial end markets.

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