Lead free solder paste

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Nihon Superior launched lead free solder paste, SN99CN P502 D4.

Features and USP: The paste has an excellent reflow and wetting on all common substrates including nickel and brass. It has a reflow peak temperature of approximately 240°C. The addition of silver (Ag) has been done for strength and stable intermetallic.

For further details: www.nihonsuperior.co.jp/english/

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