The heart of the SMT assembly process, a pick-and-place machine, is an expensive piece of equipment. With many options offered by different companies, buyers need to plan their purchases very strategically.
By Baishakhi Dutta
In the current electronics manufacturing space, a higher degree of automation is much sought after. Manufacturers want equipment that can handle many varieties of components and offer higher productivity levels. This is particularly true among high mix manufacturers. In short, the industry seeks better performing and high speed machinery.
While the latest high volume pick-and-place SMT machines come in compact form factors with high productivity, the number of manufacturers is limited.
|A few recently launched pick-and-place (high volume) machines|
|Model: NXTIII, Manufacturer: Fuji
Fuji’s new NXTIII comes with the H24S placement head, and has a capacity of 42,000 CPH with a placement accuracy of 25 microns. The H24S placement head delivers a 20 per cent higher production capacity, than its predecessor, H24G. The price of the new model is the same as the previous version. This machine delivers higher throughput, thereby reducing the number of machines required and ultimately cutting down the cost of production. Fuji NXTIII has been widely accepted in the industry with more than 60,000 machines installed worldwide.
Contact details: email@example.com, firstname.lastname@example.org; www.nmtronics.com
|Model: MY300, Manufacturer: Mycronic
Mycronic has expanded its next generation MYPro series with a compact, new MY300 pick-and-place model. The new MY300 achieves higher speeds due to its automatic job selection capability, rolling changeovers, as well as faster board transfer and tool changes. Throughput is increased significantly thanks to simultaneous assembly of multiple boards. Additionally, the improved line scan vision system ensures a future-proof solution for the most advanced components. The MY300 offers 40 per cent higher space productivity than previous models, making it possible to handle a wider range of components with a smaller machine footprint. The series offers three different models—the MY300DX, the MY300SX and the MY300LX, that come with a wide range of highly automated line configurations for any smart factory. Key features
Contact details: email@example.com; www.accurexsolutions.com
|Model: YSM10, Manufacturer: Yamaha
Launched in June 2017, the YSM10 is the latest version of the YSM20. The older YSM20 is a dual-gantry machine, whereas the newly launched YSM10 is a single-gantry machine with a capacity of 46,000 CPH. The new model is similar to that of the YSM20 with Yamaha’s unique features like side-view camera for component lead-lift detection, co-axial lighting for component verification, auto-nozzle cleaning, multi-mounting capability, etc. The YSM10 is a high speed pick-and-place machine that is suitable for various segments like EMS, automotive, lighting, etc.Key features
Contact details: firstname.lastname@example.org; www.leaptech.in
|Model: Atom, Manufacturer: Europlacer
Europlacer has launched an all-new surface mount pick-and-place platform called Atom. The company’s new high-speed capability is due to its pioneering Pulsar pipette head. Each Pulsar head features eight nozzles to handle components from 01005 profiles up to 13mm² in size, at high accuracy levels. As the Pulsar head design uses advanced titanium and titanium nitride materials, as well as self-lubricating diamond nano-coatings, the heads are completely maintenance-free. The Atom platform design moves the Pulsar heads over strategically positioned rolling-shutter imaging cameras during placement, eliminating the need for vision technology embedded in the head, and hence reducing mass. With just 50 grams of moving mass in the Z-axis, accelerations of up to 4G deliver great speed and precise placement force control.Key features
Contact details: www.bergengroupindia.com
|Model: NPM-W2S, Manufacturer: Panasoni
The NPM-W2S is designed to solve a manufacturer’s need to tighten control over the work in process, minimise changeover times, and expand feeder capacity while accommodating smaller lot sizes in a cost-effective manner. The solution also expands the standard component range from 03015mm microchips to massive 100mm x 90mm components and connectors nearly 150mm (6”) long and up to 30mm tall. Equipped with a multi-recognition camera, it enables component alignment, defect inspection, chip thickness, and 3D co-planarity inspection in a single pass to promote high productivity and quality. The single- and dual-lane mode enables the machine to process extremely long LED panels that are nearly 1200mm in length. Features include automated board support pin placement, self-aligning feeder cart changeover, intelligent feeder anywhere, and 2D-coded nozzle anywhere. It also offers thermal expansion compensation, board warp mapping, a 20- or 40-position direct pick tray tower, and closed-loop component monitoring with material verification, control and trace.Key features
Contact details: www.panasonic.com