A wafer-level chip-scale package

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Microchip Technology has launched single-I/O bus UNI/O EEPROM devices, available in miniature, wafer-level chip-scale and TO-92 packages, in addition to the 3-pin SOT-23 package.

Features and USP: Measuring 0.85 mm x 1.38 mm, the wafer-level chip-scale package (WLCSP) is approximately the size of a die, and can support a manufacturing flow using standard pick-and-place machines. The long leaded, 3-pin TO-92 package is commonly used when the manufacturing flow is a hand assembly process, or when it is mounted directly on cable assemblies.

For further details: Website: http://www.microchip.com/stellent/idcplg?IdcService=SS_GET_PAGE&nodeId=1975&country=India

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